GC600 / GC610

Embedded Gold • Ready-for-Use Industrial PCB Assembly • Intel® Atom™ E3900 Series Processor (Apollo Lake SoC)

As a member of their Embedded Gold™ ready-for-use industrial PCB assemblies, EKF presents the GC600/GC610, both fully featured industrial PCs. The GC600 basic card is equipped with an Intel® E39xx processor, and offers two connectors each for DisplayPort monitors, USB3 and M12-X Gigabit Ethernet at the front edge. The board is provided with 8GB soldered ECC RAM and a PCIe® SSD M.2 socket. The M12 power input connector accepts 9-57VDC. As GC610 assembly, the GC600 basic PCB in addition accommodates the GC010 mezzanine module, enabling wireless communication. The mezzanine card provides two M.2 sockets, suitable for both a Wi-Fi 6 (ax) and Bluetooth module, and also a WWAN modem 4G/5G & GNSS.
The GC600/GC610 is a high reliable solution for industrial environments as well as transportation and railway.

Downloads & Ressources

Documents

Specifications

General

Low power X86 based single board computer (SBC)
Intended for rugged industrial applications, ready-for-use (Embedded Gold)
Industrial PCB assembly
PCB Dimensions 133.0mm x 138.0mm (h x w)
Intel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable GC600/GC610 versions)
Versatile standard I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)
Choice of two versions – without (GC600) or with (GC610) wireless networking WLAN – WWAN – BT
SMA/SMA-RP antenna connectors (GC610)
M12 power connector
Option terminal block power connector
Wide range DC power input operation 9-57V

I/O Connectors

Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)
1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate
Dual USB 3.0 Type-A receptacles
Dual DisplayPort connectors
M12-A DC power connector
Option terminal block 3.5mm pitch 4-position screw lock power input

Additional I/O GC610

GC610 is the wireless version of GC600
Assembly of the GC600 base board and a GC010 4HP mezzanine module
SMA/SMA-RP on-board antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5, GNSS
Module RF to PCB by MHF4 to MHF4 coaxial patch cables
Optional SMA antenna connectors by MHF4 to SMA/SMA-RP pigtail cables
Dual Micro-SIM card slot for WWAN modem up to 5G

Processor

Intel® Apollo Lake (APL-I) SoC E39xx Series
x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
Graphics Burst, CPU Burst, Intel® Speedstep®
Intel® Virtualization Technology (Intel® VT-x / VT-d)
Intel® Trusted Execution Engine (Intel® TXE) 3.0

Firmware

Main Memory

Mass Storage

On-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)
Up to 2TB capacity as of current – refer to GC600/610 SKUs
Option Micro SD Card socket (SDHC, SDXC), available on request
SPI Flash 128Mbit (UEFI firmware and customer application data)
Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)
Option mezzanine storage expansion via HSE connector (up to 2 x PCIe®, 1 x USB 3.0)
Option custom specific mezzanine board design on request

Graphics

Networking

Dual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
Two M12-X circular connectors
Option 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)

Wireless Networking GC610

Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)
Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)

APL SoC I/O Usage

2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIe®/SATA)
2 x PCIe® to 2 x I210-IT networking controllers
2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)
1 x USB 3.0 to P-HSE high speed expansion port connector
2 x USB 3.0 to Type-A connectors
2 x DisplayPort to DP connectors
1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
SDIO (Micro SD Card) slot (option)
LPC to TPM 2.0 module (option)

Building Blocks

Security

Local Expansion

Mezzanine card connectors HSE and SERDES for optional local expansion
HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0
Choice of HSE based mezzanine I/O or storage modules
GC010 HSE based wireless module for Wi-Fi, Bluetooth, WWAN, GNSS connectivity (GC610)
Custom specific HSE based mezzanine module design
Option SERDES connector – Gigabit Ethernet SerDes I/F derived from I210-IS NIC
Custom specific SERDES based mezzanine switching module design

Power Requirements

Applications

Environmental & Regulatory

Designed & manufactured in Germany
Certified quality management according to ISO 9001
Long term availability
Rugged solution
Conformal coating, sealing, underfilling on request
RoHS compliant
Operating temperature -40°C to +85°C (industrial temperature range) available
Storage temperature -40°C to +85°C, max. gradient 5°C/min
Humidity 5% … 95% RH non condensing
Altitude -300m … +3000m
Shock 15g 0.33ms, 6g 6ms
Vibration 1g 5-2000Hz
EC Regulatory EN55024, EN55032, EN62368-1 (CE)
MTBF tbd years (GC600)
MTBF tbd years (GC610)

Simplified Block Diagram

Contact Us

+49 (0)2381/6890-0

GC600 / GC610

Embedded Gold • Ready-for-Use Industrial PCB Assembly • Intel® Atom™ E3900 Series Processor (Apollo Lake SoC)

EKF Elektronik GmbH

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